Molex connector catalog download#

IPass flex assemblies are compatible with the iPass connector, providing all the advantages of the high-density iPass connector systemData rates capable of 6.25 Gbps and higher to support current and future SAS and SATA signal speedsMass terminated for a reliable and consistent flex circuit-to-PCB assembly terminationExcellent for wrap-around termination applications on external ports TelecommunicationServerMass storageMedical imagingAutomatic test equipment (ATE)Military command and control centers

031') centers provides high signal densityWiping contact ensures high reliabilityAvailable in single beam, 0.80mm (.031') pitch configurations, to provide high-density and reliability available in dual-beam, 1.00mm (.039') pitch configurations, to provide contact redundancy in high-reliability applicationsFlex cable lengths of 4 to 28 inches for design flexibility VHDM and VHDM-HSD are trademarks or registered trademarks of Amphenol CorporationĬopper FlexProduct Features and Benefits ApplicationsįlexBeam Low-profile design provides optimum electrical performancePin-matrix configuration on 1.00 and 0.80mm (.039 and. Single-sidedSingle-sided, dual accessDouble-sidedġ.27 to 0.30mm (.050 to.

012') board-to-board systems, MicroCross DVI, RJ-11, RJ-45, Mini-Fit, Micro-Fit 3.0, EBBI, CradleCon, LFH, HDMI, USBįlex Jumpers Eliminates wire harnessesReduces package sizeAt least one ZIF end connection Single sidedSingle-sided, dual accessDouble-sidedMulti-layerĬ-Grid, Milli-Grid, SlimStack, 1.00 to. Virtually unlimited variety of interconnect optionsReduces assembly timeExcellent thermal management High-Density Flex Typically 2 or more layersTight line and space widthsReduces weightBetter thermal characteristics than standard rigid board constructionsĬ-Grid, Milli-Grid, SlimStack, 1.00 to. VHDM, VHDM-HSD, MZP, PCI Express, SATA, SAS, MFB, Omnigrid Multi-layer Plateau HS Mezz, SlimStack, 0.50mm (.020') stacking systems, VHDM, C-Grid, Milli-Grid, EBBIįlex Backplanes High signal frequenc圜ontrolled impedanceImproves airflow within the system Typically 3 or more layersLarge number of interconnect optionsHigh conductive routing area Rigid flex Plateau HS Mezz, SlimStack, 0.50mm (.020') stacking systems, VHDM Surface mount on both sidesStronger barrelsPress-fit connector capability Product Features Flex Construction Standard InterconnectsHigh-Speed Rigid Flex FPC interconnects are often used in applications where high signal speed, heat, flexibility or space savings are issues. Flex circuits make electronic interconnection both simpler and more reliable. Most commonly, flex acts as an interconnect device. Flex circuits are excellent for designs with high-density circuitry, and are more suited for dynamic applications such as hinge and drawer applications. An FPC can replace a traditional printed circuit board. This custom solution has a variety of applications. Flex can be designed to meet a wide range of temperature and environmental extremes. An FPC can be the best solution for creating products which are complex, small, lightweight or have harsh environmental conditions. A Flexible Printed Circuit (FPC or Flex) is an ultra-reliable technology. We are your total solution for Flexible Printed Circuitry because we design and manufacture both the flex and the connectors. R-7 to R-11Ĭopper Flex Products Molex Flexible Printed Circuit Technology is the answer to your most challenging interconnect applications. R-2 to R-4Printer Circuit and Electromechanical Assemblies.

Molex connector catalog download#

RVisit to access more part numbers and product information, download sales drawings, product specifications, 3D models, place sample requests, and more.Ĭopper Flex Products.